Bakeng sa ho fana ka litšebeletso tse sebetsanang le NFC bakeng sa bareki ba liaparo kapa liteki, k'hamphani ea brand hona joale e ka sebelisa theke ena e ntle ea NFC holim'a masela ka mekhoa e chesang. E ka hlatsuoang ebile e tiile ke lintlha tsa bohlokoa.
Moralo o tiileng o nang le kganetso ya ho tshoha.
Moralo o motle o thibelang metsi ho mamella metjhini e hlatsoang ntlo ka linako tse itseng.
Litšehetso tse fapaneng tsa NFC tsa chip le tag tailor-make li fumaneha.
Chip | NFC Tag kapa kopo ha e batloa |
Protocol | ISO/IEC 14443A |
Khafetsa ea ho sebetsa | 13.56±0.5MHz |
Nako ea ho Boloka Lintlha | 10 lilemo |
Tikoloho ea Mosebetsi | -20 ℃ ~ 50 ℃, 95% RH |
Memori ea mosebelisi | 144 Byte kapa ho ipapisitse le chip |
Programming Cycles | Lipotoloho tse 100,000 ho 25 ℃ |
Sebaka sa ho Bala | ≥1.0 CM (HUAWEI NOVA7). E ipapisitse le mohala oa NFC |
Boemo | Letšoao: Φ22±0.2mm |
Lenane: Φ20±0.2mm | Botenya: 0.68±0.08mm |
Letšoao: Φ20±0.2mm | Lenane: Φ18±0.2mm |
Botenya: 0.68±0.08mm | Ka holimo PET Material |
Ts'ebeletso ea khatiso e tšoeu kapa e mebala-bala | Hot-stamping |
Mocheso | 120 ~ 130 ℃, 5 ~ 10s |
Foromo ea ho Romela | Yuniti e le 'Ngoe |
Sephutheloana | Li-pcs tse 20 / mokotla oa opp, likhomphutha tse 200 / lebokose, likhomphutha tse 2000 / lebokose |